Die Cut Thermal Conductive Silicone Gap Filler Pad 12±5 shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF120-05ES thermally conductive interface materials are applied to fill the air gaps between ... ادامه مطلب
Die Cut Thermal Conductive Silicone Gap Filler Pad 35shore00 Thermal Conductivity 1.5w for Cpu heat sinking The TIF™100-10E thermally conductive interface materials are applied to fill the air gaps between the ... ادامه مطلب
Silicone Rubber Thermal Gap Filler 1.5 W/m-K For Automotive Engine Control Units TIF100-02E 2.01 g/cc Company Profile With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal ... ادامه مطلب
High performance silicone free thermally gap pad Z-paster140-15-02F for no-silicone required case The Z-paster140-15-02F is a high performance and compatible non-silicone material of the thermal conductive ... ادامه مطلب
Low thermal impedance conductive silicon gap filler GPU CPU heatsink cooling thermal interface pad Ziitek TIF7100HP use a special process, with silicone as the base material, adding thermal conductive powder ... ادامه مطلب
Thermal pad 0.5mm of ultra soft Gap filler Thermal Conductive Silicone Pad for GPU thermal management solutions The TIF720HZ is a silicone based, thermally conductive gap pad. Its unreinforced construction ... ادامه مطلب
Silicone Thermal Gap Filler 8.0W 2.0mmT The TIF780QE is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low... ادامه مطلب
Wholesale Electric Vehicle Thermal Pad Silica Gap Filler Thermal Pad With Durable Silicone Material Products Description TIF®100-20-11S Series thermally conductive interface materials are applied to fill the ... ادامه مطلب
Thermal Gap Filler Silicone Gap Pad With Electrical Isolation And Naturally Tacky Surface For Thermal Management The TIF® 130-20-05S is recommended for applications that require a minimum amount of pressure on ... ادامه مطلب
Wholesale Customize Thickness 1.0mm Thermal Gap Filler Silicone Thermal Pad For Memory Modules The TIF740QE is an extremely soft gap filling material rated at a thermal conductivity of 8.0W/m-K. It is specially ... ادامه مطلب