1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

1.2W/Mk Thermal Pad Multi Size Silicone Pad High-Temperature CPU Graphics Card Heat Dissipation Insulation Pad

The TIF^®100-12-05ES  is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF^®100-12-05ES is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Features

> Good thermal conductive: 1.2W/mK 
> Naturally tacky needing no further adhesive coating 
> Soft and Compressible for low stress applications
> Available in varies thickness

> Easy release construction
> Electrically isolating
> High durability

Applications

> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LED TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU