Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

Low Thermal Impedance 5.0W Ultra Soft Thermal Pad For Cloud Computing And Servers

TIF^®100-50-10E Ultra Soft Thermal Pad

• High thermal conductivity

• Low thermal impedance

• Good electrical insulation

This thermal pad's ultra-soft texture can effectively fill the gaps between electronic components and heat sinks, achieving a seamless fit.

Feature

Specifically developed for network communications, cloud computing, servers, and other high-speed computing industries, TIF^®100-50-10E Ultra Soft Thermal Pad have outstanding thermal conductivity (5.0 W/m·K) and achieve an ultra-soft texture of Shore OO 35/65. Only a light amount of pressure is needed to achieve a seamless fit and fill the gaps between electronic components and heat sinks. This enables quicker and more effective heat dissipation, enhancing overall cooling performance.

Application:

Electronic components - 5G, Aerospace, AI, AIoT, AR/VR/MR/XR, Automotive, Consumer Devices, Datacom, Electric Vehicle, Electronic Products, Energy Storage, Industrial, Lighting Equipment, Medical, Military, Netcom, Panel, Power Electronics, Robot, Servers, Smart Home, Telecom, etc.