Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

Good Insulation Performance Ultra-Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

TIF^®100-40-11E  Series is a wellbalanced, general-purpose thermal pad. It offers high thermal conductivity and moderate hardness. This balanced design provides both excellent surface conformity and superior ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.

Features:

> Higt thermal conductivity 4.0W/mK
> Super soft and highly compliant
> Self-adhesive without the need for additional surface adhesives
> Good insulation performance

Applications

> Power tools
> Network communication products
> Electric vehicle batteries
> Computer CPU/GPU Cooling
> New energy vehicle power systems

> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator
> AI Processors AI Servers

Product Specifications
Standard Thickness:0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25mm)
Standard Size:16"X16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF^® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Company Profile

 

Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.

Thermal gap pad

Thermal graphite sheet/film

Thermal double-sided tape

Thermal insulation pad

Thermal grease

Phase change material

Thermal gel

Independent R&D team

 

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