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خانه محصولاتپد هدایت حرارتی

High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

چین Dongguan Ziitek Electronic Materials & Technology Ltd. گواهینامه ها
چین Dongguan Ziitek Electronic Materials & Technology Ltd. گواهینامه ها
پد هدایت حرارتی به دنبال و کار بسیار خوب است. ما اکنون نیازی به دیگر پد های هدایت حرارتی نداریم!

—— پیتر گولسبی

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—— Antonello Sau

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—— کریس راجرز

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High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

تصویر بزرگ :  High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

جزئیات محصول:
محل منبع: چین
نام تجاری: ZIITEK
گواهی: UL and RoHs
شماره مدل: TIF700NS
پرداخت:
مقدار حداقل تعداد سفارش: 1000 عدد
قیمت: قابل مذاکره
جزئیات بسته بندی: 1000 قطعه/کیف
زمان تحویل: 3-5 روز
شرایط پرداخت: TT
قابلیت ارائه: 100000 قطعه در روز
توضیحات محصول جزئیات
نام محصولات: پدهای پرکننده شکاف نرم رسانای حرارتی 6.5 واتی با عملکرد بالا برای سرورهای هوش مصنوعی پردازنده‌های هو برنامه: پردازنده های هوش مصنوعی سرورهای هوش مصنوعی
سختی: 35/65 ساحل 00 چگالی(g/cm³): 3.4
کلمات کلیدی: پدهای پرکننده با شکاف حرارتی نرم ثابت دی الکتریک @1MHz: 7.0 مگاهرتز
رتبه بندی آتش: 94-V0 هدایت حرارتی: 6.5w/mk

High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers

 

Company pfofile

 

Ziitek company is a high-tech enterprise which dedicated to the R&D, manufacture and sales of the thermal interface materials (TIMs). We have rich experiences in this field which can support you the latest, most effective and one -step thermal management solutions. We have many advanced production equipments,full test equipments and fully automatic coating production lines which can support the production for high performance thermal silicone pad, thermal graphite sheet/ film, thermal double-sided tape, thermal insulation pad, thermal ceramic pad, phase change material, thermal grease etc. UL94 V-0, SGS and ROHS are compliant.

 

The TIF®700NS Series a well-balanced, general-purpose thermal pad. It offers excellent thermal conductivity and moderate hardness. This  balanced design provides both good surface conformity and excellent ease of use, making it capable of effectively transferring heat and providing basic physical protection for a wide range of electronic components. It is an ideal choice for addressing medium to high power heat dissipation needs, achieving the best balance between cost and performance.


Features:

 

> Good thermal conductive 6.5W
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses

 

Applications:

 

> Telecommunication hardware
> Handheld portable electronics
> Semiconductor automated test equipment (ATE)
> CPU
> Display card
> Mainboard/mother board
> Notebook
> Power supply
> Heat pipe thermal solutions

> Signal communication
> New energy vehicle
> Motherboard chip
> Radiator

> AI Processors AI Servers

 

Typical Properties of TIF®700NS Series
Property Value Test method
Color Gray Visual
Construction & Compostion Ceramic filled silicone elastomer ******
Density(g/cm³) 3.4 ASTM D792
Thickness Range(inch/mm) 0.010~0.030 0.040~0.200 ASTM D374
(0.25~0.75) (1.00~5.00)
Hardness 60 Shore 00 45 Shore 00 ASTM 2240
Recommended Operating Temperature -40 to 200℃ ******
Breakdown Voltage(V/mm) ≥5500 ASTM D149
Dielectric Constant 7.0 MHz ASTM D150
Volume Resistivity >1.0X1012 Ohm-meter ASTM D257
Flame rating V-0 UL 94 (E331100)
Thermal conductivity 6.5W/m-K ASTM D5470
6.5W/m-K ISO22007
 
Product Specifications

Standard Thickness: 0.010" (0.25 mm)~0.200" (5.00 mm) with increments of 0.010" (0.25 mm)
Standard Size: 16"X 16" (406 mmX406 mm)

Component Codes:
Reinforcement Fabric: FG (Fiberglass).
Coating Options: NS1 (Non-adhesive treatment),
DC1 (Single-sided hardening).
Adhesive Options: A1/A2 (Single-sided/Double-sided adhesive).

The TIF® series is available in custom shapes and various forms.
For other thicknesses or more information, please contact us.
High Performance Thermally Conductive 6.5W Soft Thermally Conductive Gap Filler Pads For AI Processors AI Servers 0

Packaging Details & Lead time

 

The packaging of thermal pad

1.with PET film or foam-for protection

2. use Paper Card To Separate Each Layer

3. export carton inside and outside

4. meet with customers' requirement-customized

 

Lead Time :Quantity(Pieces):5000

Est. Time(days): To be negotiated

 

Independent R&D team

 

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

اطلاعات تماس
Dongguan Ziitek Electronic Materials & Technology Ltd.

تماس با شخص: Dana Dai

تلفن: +86 18153789196

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