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CPU thermal pad TIF500s BLUE

导热硅胶片
January 30, 2021
Category Connection: پد هدایت حرارتی
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Tags:
#پد هدایت حرارتی #مواد هدایت گرما #مواد رسانای حرارتی
Brief: Discover the TIF500s BLUE CPU thermal pad, a high-performance thermal conductive gap filler designed for routers and large tolerance stack ups. With 3.0W/mK thermal conductivity and 50 Shore 00 hardness, this silicone pad ensures efficient heat dissipation and gap filling for optimal performance in telecommunication hardware and more.
Related Product Features:
  • Naturally tacky surface eliminates the need for additional adhesive coating.
  • Soft and compressible for low-stress applications, ensuring minimal pressure on components.
  • Available in various thicknesses to accommodate different gap-filling requirements.
  • Excellent thermal performance with 3.0W/mK conductivity for efficient heat dissipation.
  • RoHS compliant and UL recognized, meeting industry safety and environmental standards.
  • Stable performance across a wide temperature range from -50℃ to 200℃.
  • High tack surface reduces contact resistance, enhancing thermal transfer efficiency.
  • Suitable for a broad range of applications including routers, LED TVs, and automotive control units.
متداول:
  • What is the thermal conductivity of the TIF500s BLUE thermal pad?
    The TIF500s BLUE thermal pad offers a thermal conductivity of 3.0W/mK, ensuring efficient heat dissipation for your devices.
  • What applications is this thermal pad suitable for?
    This thermal pad is ideal for routers, telecommunication hardware, LED TVs, automotive engine control units, and other electronics requiring efficient thermal management.
  • Is the TIF500s BLUE thermal pad compliant with industry standards?
    Yes, the TIF500s BLUE thermal pad is RoHS compliant and UL recognized, meeting stringent safety and environmental standards.
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