Highly Efficient Thermal Conductivity 6.0 W/MK 100x100mm Silicone Thermal Pads For Laptop Heat Insulation Materials
The TIF®100-12-66U thermally conductive interface materials are applied to fill the air gaps between the heating elements and the heat dissipation fins or the metal base.Their flexibility and elasticity make them suited to coat very uneven surfaces.Heat can transmit to the metal housing or dissipation plate from the heating elements or even the entire PCB, which effecitly enhances the efficiency and life-time of the heat-generating electronic components.
Features:
> Good thermal conductive :1.2W/mK
> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating
> Available in varies thicknesses
Applications:
> Cooling components to the chassis of frame
> High speed mass storage drives
> Heat Sinking Housing at LED-lit BLU in LCD
> LCD TV and LED-lit lamps
> RDRAM memory modules
> Micro heat pipe thermal solutions
> Automotive engine control units
> Telecommunication hardware
> CPU
> Memory Modules
> Mass storage devices
> Automotive electronics
> Set top boxes
| Typical Properties of TIF®100-12-66U Series |
| Property |
Value |
Test method |
| Color |
Green |
Visual |
| Construction & Compostion |
Ceramic filled silicone elastomer |
****** |
| Renforcement Carrier |
Polyimide film |
******* |
| Thickness range |
0.010"(0.25mm)~0.200"(5.0mm) |
ASTM D374 |
| Specific Gravity |
2.1 g/cc |
ASTM D792 |
| Hardness |
27±5 Shore 00 |
ASTM 2240 |
| Operating Temp |
-45 ~ 200℃ |
****** |
| Dielectric Breakdown Voltage |
≥5500 VAC |
ASTM D149 |
| Dielectric Constant @1MHz |
4.0MHz |
ASTM D150 |
| Volume Resistivity |
≥1.0X1012 Ohm-cm |
ASTM D257 |
| Fire rating |
94 V0 |
UL E331100 |
| Thermal conductivity |
1.2 W/m-K |
ASTM D5470 |
Product Thicknesses: 0.010"(0.25mm)~0.200"(5.0mm)
Product Sizes: 8" x 16"(203mm x 406mm)
Individual die cut shapes and custom thickness can be supplied. Please contact us for confirming
Safe disposal method does not require special protection.The storage condition is low temperature anddry, away from open fire and away from direct sunlight. For detailed method, please refer to the product material safety data sheet.
Packaging Details & Lead time
The packaging of thermal pad
1.with PET film or foam-for protection
2. use Paper Card To Separate Each Layer
3. export carton inside and outside
4. meet with customers' requirement-customized
Lead Time :Quantity(Pieces):5000
Est. Time(days): To be negotiated
Company Profile
Dongguan Ziitek Electronic Material Technology Co., Ltd. was established in 2006. Is a high-tech enterprise specializing in the research, development, production and sales of thermal interface materials. We mainly produce: heat-conducting joint filler, low melting point thermal interface materials, heat-conducting insulator, heat-conducting adhesive tape, heat-conducting interface pad and heat-conducting grease, heat-conducting plastic, silicone rubber, silicone rubber foam, etc. We adhere to the business philosophy of "survival by quality, development by quality", and continue to provide the most efficient and best service for new and old customers with excellent quality in the spirit of rigor, pragmatism and innovation.
Certifications:
ISO9001:2015
ISO14001: 2004 IATF16949:2016
IECQ QC 080000:2017
UL
Independent R&D team
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